50 Thermal Heat Conductive Pads T-Flex 6100, Heatsink Cooling Fan CPU Peltier

Description

2108aB3F.1.20
Wholesale Lot of (50) New Thermagon (by Laird Technologies), 47mm x 66mm x 2.75mm, 600 Series, T-Flex 6100, Thermal Conductive / Electrical Insulating Gap Filler Pads, Supplier Part Number A12624-22, Customer Part Number 230-2008-01 Rev 50.  Each bid quantity is for a Lot of Fifty (50) Pads.  You may bid / buy any number of lots, up to the total quantity available above.
We have several computer shops that have requested these in larger quantities, so here you go!  In order to keep your pads from getting distorted, your order will arrive packaged in ten Ziplok bags, with each bag containing five pads.
These were purchased from an electronics liquidator earlier this year, and they were received brand new and clean in the original factory boxes.  We repackaged them in 4-mil Ziplok bags for resale.  Best we can determine, these are some kind of Boron Nitride material bound in a very soft silicone elastomer.  The result is an amazing material which is not only an effective and pliable electrical insulator, but which also absorbs and diffuses heat like a heatsink.
The manufacturer describes the firmness as 25 Shore OO.  Near as we can research, the Shore OO scale is used to rate the hardness of foam rubbers and other soft materials.  In layman's terms, it is relatively heavy and very soft to the touch, but not exactly rubbery.  It stays intact and holds its shape when handled and bent slightly, yet it can be easily cut or torn.  It is somewhat tacky when you first peel off the protective plastic, and the more you handle it the tackier it seems to get.  If you knead a piece with your fingers, it molds together almost like a stiff putty -- maybe a little stiffer and less sticky than biscuit dough.  There is little to no odor, and the only handling precaution on the datasheet is not to get it in your eyes.  Notwithstanding, I still wouldn't suggest feeding it to the kids.  It feels cold and clammy to the touch due to its extreme heat absorption properties.  Having said all that, it should be perfect for dissipating heat from densely populated circuit board components.
According to the calipers
Overall length:  2.600" / 66mm
Overall width:  1.850" / 47mm
Thickness:  .118" / 2.75mm
According to the manufacturer
:
Item # Tflex 6100, Tflex™ 600 Series Gap Filler Material
Tflex 600 Series™ is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3.0 W/m-K. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. While extremely soft, Tflex 600 recovers to over 90% of its original thickness after compression under low pressure.
Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is electrically insulating, stable from -45ºC to 200ºC and meets UL 94HB rating.
Properties
Construction and Composition:  Boron nitride filled, silicone elastomer
Color:  Blue-Violet
Thickness:  0.100 inches / 2.540 mm
Thickness Tolerance:  ±0.010 inches / ±0.250 mm
Density:  1.34 g/cc
Hardness:  25 Shore OO
Test Method - Hardness:  ASTM D2240
Tensile Strength:  15 psi
Test Method - Tensile Strength:  ASTM D412
Elongation:  75.0 %
Test Method - Elongation:  ASTM D412
UL Flammability Rating:  UL 94 V0
Shelf Life:  Indefinite
Temperature Range:  -45 to 200 ºC
Thermal Conductivity:  3.00 W/m-K
Test Method - Thermal Conductivity:  ASTM D5470 (modified)
Thermal Impedance at 10 psi:  1.23 ºC-in2/W
Thermal Impedance at 69 KPa:  7.94 ºC-cm2/W
Test Method - Thermal Impedance:  ASTM D5470 (modified)
Coefficient of Thermal Expansion:  430 ppm/ºC
Test Method - Coefficient of Thermal Expansion:  IPC-TM-650 2.4.24
Breakdown Voltage:  >5000 VAC
Test Method - Breakdown Voltage:  ASTM D149
Volume Resistivity:  2 x 1013 ohm-cm
Test Method - Volume Resistivity:  ASTM D257
Dielectric Constant at 1 MHz:  3.31
Test Method - Dielectric Constant:  ASTM D150
Dissipation Factor at 1 MHz:  >0.001
Test Method - Dissipation Factor :  ASTM D150
Features and Benefits
Very high compressibility for low stress applications
3.0 W/m-K thermal conductivity
Thickness:  3mm
Naturally tacky, often needs no further adhesive coating
Applications
Cooling multiple components to the chassis or frame
High speed mass storage drives
RDRAM memory modules
Heat pipe thermal solutions
Automotive engine control units
Telecommunications hardware
Optic fiber transmission hardware